| Category | Material |
| Substrate Materials | SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec |
| Copper Thickness | 12–105µm |
| Prepreg Types | 106, 1080, 3313, 2116, 7628 |
| Surface Treatment | HASL lead-free, Immersion Gold (ENIG), OSP, Immersion Tin, Immersion Silver, ENEPIG, Plating Gold |
| Selective Surface Treatment | ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F |
| Solder Mask Colors | Green, Yellow, Black, Matte Black, Blue, Red, White, Matte Green |
| Silkscreen Colors | White, Yellow, Black |
| Other Materials | RCC material: Copper foil (12µm), Resin (55-100µm) |
| Category | Specification |
| Layer Count | 1-64 |
| Max Board Size (2L) | 2000 × 650 mm |
| Max Board Size (4L, 6L) | 570 × 850 mm or 1150 × 430 mm (Exceeding 570 mm requires review) |
| Max Board Size (≥8L) | 570 × 670 mm or 980 × 430 mm (Exceeding 570 mm requires review) |
| Min Board Size | 0.5 × 1.0 mm (thickness ≤0.5 mm), 1.0 × 2.0 mm (thickness ≥0.5 mm) |
| Board Thickness | 0.13-8 mm |
| Drilling Capabilities | Laser: Ø0.075-0.1 mm; Mechanical: Ø0.15 mm |
| Pattern Width/Spacing | Min: 0.075 mm |
| Impedance Control | Tolerance: ±5Ω (<50Ω), ±10% (≥50Ω) |
| Min Hole Copper Thickness | 25µm (none blind/buried hole); 20µm (blind/buried hole) |
| Gold Finger | Gold Thickness: 0.25-1.3µm; Nickel Thickness: 3-5µm |
| Slot Hole | Size: 0.5-6 mm; Min Length: 1.0 mm |
| V-CUT Angle | 20°, 30°, 45°, 60° |
| Bow and Twist Limit | 0.1% (evaluation required if ≤0.3%) |
| Solder Mask Bridge Width | Min: 3 mil (Green); 5 mil (Other Colors) |
| Min Isolation (Inner/Outer) | 8 mil (Inner); 6 mil (Outer) |
| Testing | Max Current: 200 mA; Max Voltage: 250 V |
| Outline Tolerance | ±0.1 mm |
| Insulation Resistance | ≥100 MΩ |
| Ionic Cleanliness | ≤1 µg/cm² |