| Category | Material |
| FPC Main Material | Dupont, Rogers, Arlon |
| Rigid PCB Material | Panasonic, Shengyi (SY), ISOLA |
| Texture Material | PI, PET, LCP (Liquid Crystal Polymer) |
| Cover Film Material | Dupont, Tatsuta |
| Copper Foil | RA (Rolled Annealed), ED (Electrodeposited) |
| Adhesive Material | Epoxy Resin, Acrylic |
| Stiffener Material | FR4, SUS, Aluminum, PI |
| PP (Prepreg) | 106, 1080, 2116 |
| Surface Finish | ENEPIG, Hard Gold, OSP, Immersion Silver |
| PI Thickness | 0.3mil, 0.5mil, 1mil |
| Solder Mask | Taiyo, KF |
| Reinforcement Material | Glass Fabric, Carbon Fiber |
| Conductive Adhesive | Silver Paste, Conductive Epoxy |
| Dielectric Material | Rogers 4000, PTFE |
| Protective Film | Polyester Film, Kapton Tape |
| Drill Fill Material | Plugging Resin, Epoxy Fill |
| Item | Description |
| FPC Main Material | Dupont, Rogers, Arlon |
| PCB Material | Panasonic, Shengyi (SY), ISOLA |
| Texture | PI, PET, LCP (Liquid Crystal Polymer) |
| Cover Film | Dupont, Tatsuta |
| Layer Count | 2-20 layers (mass production), up to 24 layers (sample) |
| Finish Board Thickness | 0.2mm – 5.0mm (Rigid), 0.15mm – 2.0mm (Flex) |
| Min Pattern Width / Spacing | 0.04mm / 0.04mm |
| Max Finish Board Size | 250mm x 500mm |
| Finish Board Thickness Tolerance | ±0.03mm (standard), ±0.02mm (precision) |
| PP Thickness | 12um, 25um, 50um |
| Copper Thickness | 9um, 18um, 35um, 70um |
| Stiffener Material | FR4, PI, SUS, Epoxy, Aluminum |
| Surface Treatment | ENEPIG, Hard Gold, Selective OSP, Immersion Silver |
| Min Hole Size | Mechanical Hole: 0.10mm, Laser Hole: 0.08mm |
| Hole Tolerance | NPTH: ±0.03mm, PTH: ±0.05mm |
| Cover Film Color | Yellow, Black, Transparent |
| PI Thickness | 0.3mil, 0.5mil, 1mil |
| Max Number of Layers for FPC | Up to 12 layers |
| Min Finished Size | 4mm x 6mm |
| Min Pad Size | Inner Layer: 4mil, Outer Layer: 3.5mil |
| Stiffener Min Size | 3mm x 4mm |
| Stiffener Max Size | 35mm x 35mm |
| Stiffener Alignment Accuracy | ±0.05mm |
| Cover Minimum Opening Size | 0.4mm x 0.4mm (precision tooling) |
| Minimum Opening Spacing for Covering Film | 0.15mm (laser cutting), 0.10mm (stamping) |
| Coating Film Overflow Amount (Unilateral) | Standard: 0.05-0.1mm, Precision: ≤0.03mm |
| Min Diameter of Gold Finger Semicircle Hole | 0.2mm |
| Peel-off Strength | ≥1.8N |
| Planeness | ≤10um (before baking), ≤25um (after baking) |
| Thermal Shock | 300℃ (3 times, 10 seconds each) |
| W/B Gold Wire Pull Strength | ≥8g |
| Rigid-Flex PCB Min Board Thickness | FPC: 0.08mm, 4 Layers: 0.25mm, 10 Layers: 0.7mm |