| Process Parameter | Capability |
|---|---|
| Layer Count | 1-64 layers |
| Material Types | FR-4, High-frequency materials, High-speed materials, Metal base materials |
| Layer Stackup | (Rogers, PTFE) + FR-4 |
| Material Brands | Lianmao, Shengyi, TUC, Nanya, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, etc. |
| Board Thickness Range | 0.2 mm to 8.0 mm |
| Board Thickness Tolerance | Standard tolerance: ±0.1 mm (thickness ≤1.0 mm), ±10% (thickness >1.0 mm) |
| Outer Layer Copper Thickness | 0.33 oz to 14 oz |
| Inner Layer Copper Thickness | 0.5 oz to 12 oz |
| Laser Hole Diameter | 0.075 mm to 0.15 mm |
| Minimum Hole Size | 0.1 mm |
| Backdrill Hole Diameter | 0.2 mm |
| Backdrill Short Tube | 0.05 mm to 0.25 mm |
| Minimum Resin Plug Hole Size | 0.15 mm |
| Laser Scan Passes | 1-5 passes (≥6 passes require approval) |
| Minimum Line Width/Spacing | 2/2 mils |
| Impedance Accuracy | Standard tolerance: ±10% (<50Ω), ±10% (≥50Ω) |
| Aspect Ratio (Plated Through Hole) | 25:1 |
| Aspect Ratio (Laser Drilled Hole) | 1:1 |
| Maximum Finished Size | 1500 mm x 620 mm |
| Minimum Finished Size | 2.0 mm x 2.0 mm |
| Minimum BGA Pitch | 0.35 mm |
| Profile Tolerance | ±0.1 mm |
| Solder Mask Colors | Green, Matte Green, Black, Matte Black, Yellow, Red, Blue, White |
| Surface Finishing Options | Immersion Gold, Hard Gold Plating, Gold Finger Plating, Lead-Free HASL, HASL, OSP, Chem. Nickel/Gold, Soft Gold (Nickel/No Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+Corrosive Ferrite, Full Gold Plating+Corrosive Ferrite, Silver Plating+Corrosive Ferrite, Tin Plating+Corrosive Ferrite |