| Material Category | Material Name |
|---|---|
| Substrate Materials | FR4 |
| High-Frequency FR4 | |
| PTFE (Polytetrafluoroethylene) | |
| Rogers 4003 | |
| Rogers 4350B | |
| CEM-1 | |
| CEM-3 | |
| Polyimide (PI) | |
| Ceramic | |
| Conductive Layer Materials | Copper (Cu) |
| Gold (Au) | |
| Silver (Ag) | |
| Insulating Materials | Polyimide (PI) |
| Epoxy Resin (EP) | |
| Polyester Film (PET) | |
| PEEK (Polyetheretherketone) | |
| Soldering Materials | Tin (Sn) |
| Tin-Lead Alloy (SnPb) | |
| Lead-Free Solder Alloy (Pb-Free) | |
| Surface Finishing | Gold Finger Plating |
| OSP (Organic Solderability Preservative) | |
| ENIG (Electroless Nickel Immersion Gold) | |
| Conductive Inks | Silver Conductive Ink |
| Copper Conductive Ink | |
| Contact Materials | Silver Plated Contact Material |
| Auxiliary Materials | Glass Fiber Cloth |
| Epoxy Resin | |
| Thermosetting Plastics | |
| Other Materials | Silicone |
| Thermally Expanding Film | |
| Polyurethane (PU) |