| Category | Specification |
| Assembly Type | SMT, THT, Mixed Technology |
| Component Placement Accuracy | ±0.03mm |
| Component Types | 0201, 01005, BGA, QFN, CSP, POP, Flip-Chip |
| Max PCB Size | 600mm x 500mm |
| Min PCB Thickness | 0.3mm |
| Max PCB Thickness | 6mm |
| Max Number of Layers | 1-64 Layers |
| Component Height | Up to 15mm |
| Stencil Thickness | 0.08mm – 0.3mm |
| Reflow Soldering | Leaded and Lead-Free Processes |
| Wave Soldering | Through-hole and Mixed Technology |
| Selective Soldering | Precision THT soldering |
| Pick-and-Place Speed | 80,000 CPH (Components per Hour) |
| Inspection Capabilities | AOI, X-Ray, ICT, Flying Probe, Functional Testing |
| BGA Pitch | 0.3mm |
| Micro-Via Diameter | 0.1mm |
| Conformal Coating | Acrylic, Silicone, Urethane |
| Connector Assembly | High-Density Connectors, Coaxial Connectors, Custom Options |
| Cable and Harness Assembly | Complex Wire Harnesses, Custom Cable Assemblies |
| Turnkey Services | Component Sourcing, PCB Fabrication, Assembly |
| Supported PCB Types | Rigid, Flex, Rigid-Flex, High-Frequency |
| Solder Paste Types | No-Clean, Water-Soluble, Lead-Free |
| Placement Capability | Fine-Pitch Components, 0.5mm QFP, 0.4mm LGA |
| Thermal Profile Control | ±1°C |
| Double-Sided Assembly | Yes |
| Minimum Trace/Space | 3mil/3mil |
| Special Technologies | PoP (Package on Package), Underfill, Wire Bonding |
| Packaging Types | Tape & Reel, Tray, Tube, Bulk |
| Batch Sizes | Prototype to High Volume |
| Environmental Compliance | RoHS, REACH, WEEE |
| Production Lead Time | 3-15 Days (Depends on Complexity) |