multi-layer PCB
High-end design, multi-layer PCB internal structure and experience sharing
Read MoreLarge size PCB Manufacturing
Large size PCB sample display produced by HXPCB
HXPCB focuses on the research and development of ultra-large size circuits board, multi-layer PCBs, metal-based PCBs, rigid-flex high-frequency PCBs, HDI PCBs, and related processes. We offer comprehensive services, including PCB design, prototyping, processing, and assembly.
What is a large size PCB?
Large-size PCBs usually refer to circuit boards whose area or size exceeds that of traditional standard PCBs. Due to the large size of the PCB, the production process is very demanding on technology and equipment. PCBs like this are widely used in large electronic equipment and industrial equipment, and are also a very important category in the PCB industry.
HXPCB is a company engaged in PCB manufacturing and assembly services. We have nearly a thousand employees, more than a hundred teams of engineers and advanced equipment, which ensures our competitiveness in the industry. We only provide high-quality products and services to ensure that every customer’s purchase from us is worth the money.
Characteristics of Large Size PCB
Size and thickness: The area of a large-size PCB may range from a few hundred square centimeters to several square meters, and the thickness is usually increased as needed to increase structural strength.
Material selection: Large-size PCBs may require specific substrates to ensure strength, thermal management, and reduce signal attenuation.
Production process: The production process may be more complicated, such as additional welding, splicing, and testing procedures to ensure the performance and quality of the circuit board.
Difficulties in manufacturing large-size PCBs
1. Length compensation (Length Matching) of the signal path is required to ensure signal synchronization
2. There is a lot of material waste, high processing accuracy requirements, and the yield rate may be reduced, resulting in increased costs
3. The size and capacity of the equipment (such as laminators and exposure machines) limit the manufacturability of large-size PCBs
4. Large-size PCBs are easily deformed or damaged by external forces due to their increased area
During manufacturing, due to the large size of the board, warping, delamination and internal layer alignment deviation are prone to occur
Materials for making large size PCBs
| Material Type | Material Name |
| Substrate Material | FR-4 (Standard/High Tg) |
| Metal Substrate (Aluminum/Copper) | |
| Ceramic Substrate (AlN/Al₂O₃) | |
| Conductive Layer Material | Electrolytic Copper Foil (ED Copper) |
| Rolled Copper Foil (RA Copper) | |
| Coating Treatments (Gold Flash/OSP, etc.) | |
| Insulation and Dielectric Material | Rogers (RO4350B, etc.) |
| PTFE (Polytetrafluoroethylene) | |
| High-Speed FR-4 | |
| Reinforcement and Support Material | Fiberglass Cloth |
| Polyimide Film | |
| Metal Backing | |
| Protection and Solder Mask Material | Solder Mask |
| Coverlay | |
| Filling and Adhesive Material | Prepreg |
| Conductive Adhesive | |
| Thermal Fillers/Thermal Adhesives |
Application areas of large size PCB
| Application Area | Specific Use |
| Servers and Data Centers | Server motherboards, large storage systems |
| High-Performance Computing (HPC) | Supercomputers, AI computing platforms |
| Communication Base Stations and 5G Devices | 5G base station antennas, large RF modules |
| Power Electronics and Energy Systems | Power converters, large power management systems |
| Industrial Automation and Control Systems | PLC motherboards, industrial control system boards |
| Aerospace and Satellite Communication | Satellite circuit boards, avionics systems |
| Automotive Electronics and Electric Vehicles | Battery management systems (BMS), power systems |
| Large LED Lighting Systems | High-power LED driver circuits |
| Medical Equipment | Large imaging devices (CT/MRI), diagnostic equipment |
| Military and Defense | Radar systems, communication control boards |
Large size PCB production process
Material selection: The substrate of PCB is usually made of glass fiber reinforced epoxy resin (FR4), ceramic, polyimide and other materials. Copper foil is used to form a conductive path. The choice of substrate and copper foil determines the mechanical strength, conductivity and thermal stability of the circuit board.
• Production of core board: First, clean the copper clad board, and then cover the surface with a layer of photosensitive film. This film will solidify when exposed to light, forming a protective film on the copper foil of the copper clad board. The photosensitive film on the copper foil is irradiated with a UV lamp through a photosensitive machine, and the copper foil covered under the cured photosensitive film is the required PCB layout circuit.
• Inner layer PCB layout transfer: Make two layers of circuits on the middle core board. After the copper clad board is cleaned, a layer of photosensitive film will be covered on the surface, and then the photosensitive film on the copper foil is irradiated with a UV lamp through a photosensitive machine, and the copper foil covered under the cured photosensitive film is the required PCB layout circuit.
• Core board punching and inspection: Punch alignment holes on the core board to facilitate alignment with other raw materials. Once the core board is pressed together with other layers of PCB, it cannot be modified, so inspection is very important.
• Lamination: Use prepreg as an adhesive between the core board and the core board, and between the core board and the outer copper foil, and also play an insulating role. The layers are firmly pressed together by a high-temperature and high-pressure laminator.
• Drilling: Drill through holes from top to bottom to open up the PCB, and then metallize the hole wall to conduct electricity.
• Chemical precipitation of copper on the hole wall: A layer of conductive material is deposited on the hole wall, and a copper film is formed on the entire PCB surface, including the hole wall, by chemical deposition.
• Transfer of outer layer PCB layout: Transfer the outer layer PCB layout to the copper foil, and the process is similar to the previous inner layer core board PCB layout transfer principle.
• Surface treatment: In order to protect the circuit board and improve its welding performance, common surface treatment methods include HASL and ENIG.
• Solder mask: Covering the circuit board to protect the copper conductor from oxidation and prevent short circuits during welding.
• Silkscreen: used to identify components, pin numbers and other important information on the PCB.
• Testing: Electrical testing, mainly testing the conductivity of each circuit to ensure that there are no short circuits or open circuits.
• Finished board cutting and packaging: After manufacturing, the PCB will be cut according to the design requirements to form the final shape. It will then be cleaned, inspected and packaged for delivery to customers.
These steps together constitute the manufacturing process of oversized PCBs. Each step is crucial. Only by accurately controlling the process of each link can we ensure the production of high-quality PCBs.
Advantages of HXPCB production
1. High quality standards
We use advanced manufacturing processes and strict quality control to ensure that each PCB meets high standards and has good electrical performance and reliability.
2. Customized design
We provide flexible customization options and can design large-size PCBs according to customers’ specific needs and application scenarios, including materials, number of layers, and circuit layout.
3. Fast delivery
We have efficient production processes and logistics management, which can complete the production and delivery of large-size PCBs in a short time to meet the requirements of urgent projects.
4. Comprehensive customer support
We provide professional technical support and after-sales service to help customers solve various problems during design, production and use.
5. Cost-effectiveness
We provide competitive prices while ensuring high-quality products and services by optimizing production processes and economies of scale.
6. Extensive industry application experience
We have accumulated rich application experience in multiple industries (such as communications, medical, automotive, industrial, etc.), and can quickly understand customer needs and provide solutions.
Choose our large-size PCBs, you will get high-quality, high-performance product support, as well as comprehensive service guarantees. If you have any specific needs or questions, please feel free to contact us!
Our PCB assembly capabilities
Large PCB Manufacturing and Assembly Capability：Supports single-sided, double-sided, and multilayer PCBs, with a maximum size of 1.5m x 0.6m.
Warping Prevention Technology：Utilizes high Tg materials, fixtures, and optimized temperature profiles to prevent PCB warping and deformation.
High-Precision SMT Placement：Equipped with advanced high-precision placement machines to ensure accurate component placement, accommodating devices from 0201 to BGA.
Reflow and Wave Soldering Processes：Employs large reflow ovens and selective wave soldering to ensure uniform and reliable soldering quality.
Product Testing：Provides AOI, X-Ray, ICT, and functional testing to ensure product performance and reliability.
Thermal Management Systems：Applicable for high-power PCBs, supporting metal substrates (aluminum and copper) and thermal interface materials.
Fast Delivery and Flexible Production：Offers services from prototypes to mass production, quickly responding to customer needs and shortening delivery times.
One-Stop Service：Covers PCB manufacturing, component sourcing, SMT placement, soldering, inspection, and assembly for hassle-free delivery.
Industry Experience：Over 10 years of industry experience, providing services for telecommunications, automotive, medical, and industrial sectors.
Why choose our products and services
1. Fast turnaround: Prototypes are delivered as fast as 24 hours, and scalable production is available based on large-volume orders.
2. Customization: Tailor-made solutions based on specific customer requirements.
3. High quality standards: Comply with ISO9001 and IATF16949 quality management systems.
4. Reliability: Ensure performance and durability of complex, large-size PCBs.
5. Cost optimization: Advanced processes and equipment reduce production costs.
HXPCB is committed to becoming your trusted large-size PCB
manufacturing and assembly partner. Whether it is prototypes, small-batch production or large-scale orders, we provide efficient, reliable and high-quality services. Choosing HXPCB is equivalent to choosing peace of mind, peace of mind and peace of mind.
FAQ
Frequently Asked Question
HXPCB can manufacture large-size PCBs with a maximum size of 1.5m x 0.6m. This size is suitable for applications like industrial control systems and LED displays.
Common materials include FR4 (high-Tg versions), aluminum-core substrates for heat dissipation, and specialized Rogers laminates for high-frequency applications.
Large-size PCBs are widely used in:
Industrial control systems
1.LED lighting displays
2.5G communication base stations
3.Medical devices (e.g., imaging systems)
4.Automotive power systems
HXPCB uses high-Tg materials, reinforced fixtures, and optimized reflow soldering temperature profiles to prevent warping. We also employ layer symmetry and uniform copper distribution in PCB designs.
HXPCB performs comprehensive testing, including AOI, X-Ray inspection, ICT, and functional testing, to verify soldering quality, alignment accuracy, and electrical performance.
The main challenges include warpage control, uneven heat distribution during reflow soldering, and ensuring accurate SMT placement over a large area. HXPCB addresses these through advanced equipment and process optimization.
Yes, HXPCB has expertise in manufacturing multilayer large-size PCBs up to 20 layers. Our advanced lamination and layer alignment processes ensure high reliability and performance.
HXPCB uses anti-static bags, reinforced protective layers, and custom wooden crates or foam inserts to prevent mechanical stress and ensure safe transport of large-size PCBs.
HXPCB Manufacturer: Blog
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