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HXPCB focuses on the research and development of ultra-large size circuits board, multi-layer PCBs, metal-based PCBs, rigid-flex high-frequency PCBs, HDI PCBs, and related processes. We offer comprehensive services, including PCB design, prototyping, processing, and assembly.
What is a high-frequency PCB?
High-frequency (radio wave signal range from 3 MHz to 30 MHz or higher) PCB refers to a special type of PCB that can handle radio wave signals above 500 MHz or 2 GHz. It is often referred to as a PCB that can handle extremely high frequencies. High-frequency PCBs require special design and manufacturing requirements to maintain their service life.
High-frequency PCBs are different from standard PCBs that usually use materials such as FR4. High-frequency PCBs are usually made of advanced materials such as PTFE (Teflon), Rogers or other low dielectric constant materials. These materials are selected because they can minimize signal loss, reflection and interference to ensure the integrity of high-frequency signals.
The design of high-frequency PCBs requires precision. Factors such as conductor width, spacing and substrate constant must be carefully controlled to ensure signal integrity. These PCBs are widely used in applications that require fast and precise signal processing, such as 5G networks, radars, and satellite communication systems.
Due to the need for advanced materials and manufacturing techniques, high-frequency PCBs are more expensive than standard PCBs. However, their performance is critical to enabling fast, low-latency communication systems, which is essential for mobile communications.
HXPCB is a professional PCB manufacturer, offering a wide range of PCB solutions, including high-frequency PCBs, multi-layer PCBs, HDI (High-Density Interconnect) boards, and flexible PCBs. They provide services that cater to both small batch prototyping and large-scale mass production. HXPCB is known for its flexibility, offering fast production times, often between 12 to 72 hours, making them a reliable partner for customers needing quick turnaround.
What are the advantages of high-frequency PCB?
High-frequency PCBs offer several advantages and are essential for applications requiring high-performance signal transmission. Here are the main advantages:
1. Low signal loss: High-frequency PCBs use materials with lower dielectric constants, such as PTFE and Rogers, which can minimize signal loss during transmission, thereby improving signal efficiency and quality.
2. Reduce signal reflections and interference: The design and materials of high-frequency PCBs help reduce signal reflections and crosstalk, which is critical for high-speed data transmission and maintaining signal integrity.
3. Higher frequency processing capability: High-frequency PCB can handle frequencies above 300 MHz or even up to several GHz.
4. Stability and reliability: High-frequency PCBs are made of materials with excellent electrical properties and chemical stability, ensuring long-term use in harsh environments and meeting high reliability requirements.
5. Enhanced system performance: Devices using high-frequency PCBs enable faster signal processing and lower latency, thereby improving overall system performance
Support high-speed signal transmission: The design of high-frequency PCB optimizes the signal path, reduces interference during transmission, and supports high-speed, low-latency real-time communication.
Some unique features in high-frequency PCB processing,
| Characteristic | Description |
| Material Selection | Use materials with low dielectric constant and low loss, such as PTFE and ceramic substrates. |
| Dielectric Constant Control | Precise control of dielectric constant to affect signal propagation speed and impedance matching. |
| Impedance Control | Strict impedance control for specific traces to ensure signal integrity. |
| Layer Stack Design | Multi-layer structures to improve signal pathways and reduce electromagnetic interference (EMI). |
| Manufacturing Precision | Higher manufacturing precision required, especially for trace width, spacing, and hole sizes. |
| Thermal Management | Consider thermal management design to prevent overheating in high-frequency circuits. |
| Shielding and Grounding Design | Good shielding and grounding layout to reduce electromagnetic interference and improve signal stability. |
| Testing and Verification | Rigorous testing after manufacturing to verify that the board meets high-frequency performance requirements. |
Common high frequency PCB material parameter table
The parameters of high-frequency PCBs are usually closely related to specific applications, materials, designs, and manufacturing processes. The following is a detailed parameter table of some common high-frequency PCB materials, including information such as dielectric constant, loss tangent, thickness, impedance, etc.
| Material Type | Dielectric Constant (εr) | Loss Tangent (tan δ) | Frequency Range | Thickness | Impedance Range |
| FR-4 | 4.4 — 4.6 | 0.02 — 0.03 | ≤ 1 GHz | 0.2 mm — 1.6 mm | 50 Ω |
| PTFE (Teflon) | 2.1 — 2.2 | 0.0002 — 0.0005 | 1 GHz — 60 GHz | 0.5 mm — 3.0 mm | 50 Ω |
| Ceramic Substrate | 3.0 — 10.0 | 0.001 — 0.01 | ≥ 1 GHz | 0.5 mm — 2.5 mm | 50 Ω |
| Isola FR-408 | 3.6 | 0.018 | ≤ 2 GHz | 0.2 mm — 1.6 mm | 25 Ω, 50 Ω |
| Rogers RO4003C | 3.38 | 0.0027 | 1 GHz — 40 GHz | 0.5 mm — 1.6 mm | 50 Ω |
| Rogers RO4350B | 3.48 | 0.0037 | 1 GHz — 30 GHz | 0.5 mm — 1.6 mm | 50 Ω |
| Rogers RT/Duroid | 2.2 — 10.2 | 0.0002 — 0.003 | 1 GHz — 65 GHz | 0.508 mm — 3.0 mm | 50 Ω |
Important Considerations：
1.Dielectric Constant (εr): Affects signal propagation speed and signal integrity; select appropriate materials based on design requirements.
2.Loss Tangent (tan δ): Indicates the dielectric loss of the material; the lower the loss, the less signal attenuation.
3.Frequency Range: Effective range of frequencies supported by different materials; should be considered based on the application scenario.
4.Thickness: Affects the structure, flexibility, and overall performance of the design; thicker boards are suitable for higher mechanical strength.
5.Impedance: High-frequency signals require strict impedance matching to reduce reflections and losses.
When selecting suitable materials for high-frequency PCBs, consider specific application requirements, signal characteristics, and thermal management, among other factors.
High frequency PCB application areas
radar system
Application of high frequency PCB in radar system
aerospace
High frequency PCB application in aerospace
satellite communication
Application of high frequency PCB in satellite communication
microwave equipment
Application of high frequency PCB in microwave equipment
wireless communication
Application of high frequency PCB in wireless communication
automotive electronics
Application of high frequency PCB in automotive electronics
HPC Equipment
High-frequency PCB applications in high-performance computing equipment
measurement equipment
High frequency PCB applications in test and measurement equipment
High Frequency PCB Manufacturing Services from HXPCB
HXPCB Manufacturing not only provides high-quality high-frequency PCB assembly solutions, but also has its own PCB boards. We customize products for customers with strict quality standards to ensure that each circuit board can perfectly meet various application requirements. From raw material procurement to every link of the production process, we adhere to the attitude of excellence.
Common product cases
| Product Name | Application | Frequency Range | Layer Count | Material | Special Features |
| RF Amplifier PCB | RF signal amplification | Up to 6 GHz | 4 | Rogers 4350B | Low loss, high thermal stability |
| Wi-Fi Router PCB | Wireless communication | 2.4 GHz & 5 GHz | 4 | FR-4 | Integrated antennas, multi-layer design |
| 5G Base Station PCB | Telecommunication for 5G networks | 24 GHz to 100 GHz | 6 | Rogers 5880 | High-frequency performance, low insertion loss |
| Microwave PCB | Microwave frequency applications | 1 GHz to 30 GHz | 2-4 | PTFE | High thermal conductivity, lightweight |
| Automotive Radar PCB | Collision avoidance systems for vehicles | 77 GHz | 4 | Rogers RO4003C | High reliability, compact size |
| Satellite Communication PCB | Satellite dishes and transceivers | 1 GHz to 40 GHz | 4-6 | PTFE | Low dielectric loss, high precision |
| Bluetooth Module PCB | Short-range wireless communication | 2.4 GHz | 2 | FR-4 | Miniaturized design, high power efficiency |
PCBA OEM/EMS solution provider
HXPCB focus on providing customers with efficient and precise PCB assembly and manufacturing services. From design, production, testing to delivery, our comprehensive services ensure the optimization of product quality and production cycles, meeting the needs of various industries.
PCB Assembly
Our PCBA (Printed Circuit Board Assembly) capabilities are extensive, catering to diverse needs from R&D prototyping to large-scale production. We are committed to delivering high-quality PCBA services, ensuring reliable produ
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PCB Manufacturing
HXPCB possesses advanced PCB manufacturing capabilities, meeting a wide range of needs from simple to complex circuit boards. We offer single/double-sided PCBs, multilayer boards, HDI (High-Density Interconnect) PCBs, flexible PCBs (FPC), and rigid-flex PCBs.
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Free proofing
HXPCB has advanced PCBA testing capabilities, including electrical testing, automated optical inspection (AOI), functional testing, and more.
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FAQ
Frequently Asked Question
High-frequency PCBs are printed circuit boards designed to operate at frequencies typically above 1 GHz. They are used in applications where high-speed signal processing is critical.
RF microwave PCBs are a subset of high-frequency PCBs specifically engineered to handle microwave frequencies (usually defined as 1 GHz to 300 GHz). They are often used in applications involving RF signals and microwave technology.
Ordinary PCBs are usually made of FR-4, a glass fiber reinforced epoxy resin. This material is suitable for standard electronic devices operating at low frequencies.
High-frequency PCBs: usually use specialized materials such as PTFE (Teflon), Rogers material, or ceramic-filled substrates, which have lower dielectric constants and better thermal stability. These materials minimize signal loss and maintain consistent performance at high frequencies.
HXPCB is able to produce the following types of PCBs to meet customers' requirements from simple to complex FR-4 PCB, IMS PCB (metal substrate) HDI (high density interconnect) , rigid-flex PCB, high-frequency PCBs multi-layer PCB, high precision PCB, special material PCB, flexible PCB (FPC), thick copper PCB
Yes, we (HXPCB) provide high-frequency PCBs assembly (PCBA) services, providing customers with one-stop PCB assembly services, our services include SMT patch assembly, plug-in assembly, mixed assembly, parts procurement services, functional testing, small batch to large batch solutions
Testing high-frequency PCBs (Printed Circuit Boards) is crucial to ensure their performance, reliability, and compliance with design specifications. Here are several methods and steps you can take to effectively test high-frequency PCBs:1. Visual Inspection，2. Electrical Testing，3. Impedance Measurement，4.Time-Domain Reflectometry (TDR)，5. RF and Microwave Testing，6. Signal Integrity Analysis，7. Thermal Testing，8. Environmental Testing，9. Functional Testing，10. Aging and Reliability Testing
Yes, HXPCB specialize in high-frequency and HDI (High-Density Interconnect) PCBs.We use advanced materials like Rogers, Taconic, and other high-frequency laminates to ensure minimal signal loss and high performance.HDI PCBs feature blind vias, buried vias, and microvias, allowing for higher circuit density and more compact designs.We have the capabilities to produce high-quality high-frequency and HDI PCBs to meet the needs of demanding applications. Feel free to reach out for more details!
Yes, we (HXPCB) provide comprehensive high-frequency PCBs testing services to ensure the quality and reliability of your boards. Our testing services include: Electrical Testing,Automated Optical Inspection (AOI),X-ray Inspection,Functional Testing,Environmental Testing
We (HXPCB) ensure fast worldwide delivery through a combination of efficient production processes and reliable logistics partnerships. Here are the key factors that help us meet tight deadlines and ensure timely delivery: Fast Production Lead Times,Reliable Shipping Partners,Streamlined Logistics & Warehousing,Real-Time Tracking & Updates,Dedicated Support Team
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