| Material Type | Series | Specific Models |
| Rogers Materials | RO3000 Series | RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210 |
| RO4000 Series | RO4003C, RO4350B, RO4360, RO4533, RO4700, RO4835 | |
| RT5000 Series | RT5870, RT5880 | |
| RT6000 Series | RT6002, RT6035, RT6006 | |
| Laminates (Prepregs) | RO4403 (4mil), RO4450B (4mil), RO4450F (4mil), RO3001 (1.5mil), RO2929 | |
| Arlon Materials | Arlon Series | Diclad, Cuclad, Isoclad, AD Series, CLTE |
| Laminates (Prepregs) | 25FR1080 (4mil), 25FR2112 (6mil), Cuclad6700 (1.5mil) | |
| Taconic Materials | Taconic Series | TLX, TLY, RF, TLC, TLG Series, CER10 |
| Laminates (Prepregs) | TP-32 (4mil), TPG (4mil), HT1.5 (1.5mil) | |
| Wanglin Materials | Wanglin Series | F4BK, F4BM, F4B, TP-1/2, TF-1/2, CT330, CT350, CT440, CT615 |
| Finished Copper Thickness | All Materials | 0.5oz – 120oz |
| Dielectric Constant (Dk) | All Materials | 1 – 25 |
| Hybrid Combinations | Rogers/FR4/Taconic/Arlon Mixed | Supported |
| Thermal Conductivity | All High-Frequency Materials | Up to 2.2 W/m·K |
| Material Tolerances | Thickness | ±0.05mm |
| Capability | HXPCB Specifications |
| Layer Count | 1-50 layers |
| Maximum Board Size | Single/Double Side: 1200×430mm; Multilayer: 880×600mm |
| Minimum Board Size | 10×10mm |
| Minimum Line Width/Spacing | 0.075mm (3mil) |
| Finished Copper Thickness | Up to 6oz |
| Drilling Capability | Minimum hole diameter: 0.2mm |
| Finished Board Thickness | 0.13mm – 6.0mm |
| Impedance Control | ±5% |
| Dielectric Constant (Dk) | 1-25 |
| Loss Tangent (Df) | ≤0.002 |
| Surface Finishes | ENIG, OSP, Immersion Silver, Immersion Tin, HASL |
| Hybrid Material Lamination | Rogers, Taconic, Arlon, and FR-4 combinations |
| Aspect Ratio | 12:1 |
| Blind/Buried Vias | Supported |
| Backdrilling | Available |
| High-Tg Materials | Tg >170°C |
| PTFE Processing | Special expertise in PTFE handling |
| Thermal Conductivity | Up to 2.2 W/m·K |
| Solder Mask Options | Green, Blue, Black, White, and Custom |
| Registration Tolerance | ±0.05mm |
| Via-in-Pad Capability | Supported |