HDI PCB Process Capabilities
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HDI PCB Process Capabilities
Item
Description
Specifications
Materials & Brands
Materials used in production
Rogers (RO3000, RO4000, RT5000, RT6000), Taconic, Arlon, Wanglin, ITEQ, SY, KB, NOUYA
HDI Construction
Available constructions
1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, AnyLayer
Construction Order
Layer arrangement orders
N+N, N+X+N, 1+(N+X+N)+1
Layer Count
Number of layers
1-40 Layers
Min Pattern Width/Spacing
Minimum achievable pattern width/spacing
2mil / 2mil
Min Mechanical Hole Size
Smallest mechanical hole size
0.15mm
Min Laser Hole Size
Smallest laser-drilled hole size
0.075mm – 0.1mm
Max Resin Plug Hole Diameter
Maximum size of resin plug holes
0.4mm
Electroplating to Fill Holes
Electroplating for hole filling available
Yes
Electroplating Hole Filling Size
Range for electroplating fill
3-5mil
Hole Pile Pad/Hole Pile Hole/VOP
Availability of hole pile configurations
Yes
Via Hole Distance from Pattern
Minimum distance from via hole to pattern
7mil
Laser Drilling Hole Accuracy
Precision for laser-drilled holes
0.025mm
Min BGA Pad Center Distance
Minimum pad center distance for BGA designs
0.3mm
Min SMT Pad Size
Minimum pad size for Surface Mount Technology (SMT)
0.25mm
Plating Hole-Filling Sag
Maximum plating sag in filled holes
≤10um
Back Drilled/Countersink Hole Tolerance
Tolerance for back-drilled and countersink holes
±0.05mm
Through-Hole Plating Penetration Rate
Through-hole plating ratio
16:1
Blind Hole Plating Penetration Rate
Blind-hole plating ratio
1.2:1
BGA Min Pad Size
Minimum pad size for BGA
0.2mm
Min Buried Hole (Mechanical)
Minimum size for buried mechanical hole
0.2mil
Min Buried Hole (Laser)
Minimum size for buried laser-drilled hole
0.1mil
Min Blind Hole (Mechanical)
Minimum size for blind mechanical hole
0.2mil
Min Blind Hole (Laser)
Minimum size for blind laser-drilled hole
0.1mil
Min Laser Hole Size
Smallest laser hole (depth ≤ 55um)
0.10mil
Interlaminar Alignment Tolerance
Alignment accuracy for multi-layer boards
±0.05mm (±0.002″)