HDI PCB Process Capabilities

Item Description Specifications
Materials & Brands Materials used in production Rogers (RO3000, RO4000, RT5000, RT6000), Taconic, Arlon, Wanglin, ITEQ, SY, KB, NOUYA
HDI Construction Available constructions 1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, AnyLayer
Construction Order Layer arrangement orders N+N, N+X+N, 1+(N+X+N)+1
Layer Count Number of layers 1-40 Layers
Min Pattern Width/Spacing Minimum achievable pattern width/spacing 2mil / 2mil
Min Mechanical Hole Size Smallest mechanical hole size 0.15mm
Min Laser Hole Size Smallest laser-drilled hole size 0.075mm – 0.1mm
Max Resin Plug Hole Diameter Maximum size of resin plug holes 0.4mm
Electroplating to Fill Holes Electroplating for hole filling available Yes
Electroplating Hole Filling Size Range for electroplating fill 3-5mil
Hole Pile Pad/Hole Pile Hole/VOP Availability of hole pile configurations Yes
Via Hole Distance from Pattern Minimum distance from via hole to pattern 7mil
Laser Drilling Hole Accuracy Precision for laser-drilled holes 0.025mm
Min BGA Pad Center Distance Minimum pad center distance for BGA designs 0.3mm
Min SMT Pad Size Minimum pad size for Surface Mount Technology (SMT) 0.25mm
Plating Hole-Filling Sag Maximum plating sag in filled holes ≤10um
Back Drilled/Countersink Hole Tolerance Tolerance for back-drilled and countersink holes ±0.05mm
Through-Hole Plating Penetration Rate Through-hole plating ratio 16:1
Blind Hole Plating Penetration Rate Blind-hole plating ratio 1.2:1
BGA Min Pad Size Minimum pad size for BGA 0.2mm
Min Buried Hole (Mechanical) Minimum size for buried mechanical hole 0.2mil
Min Buried Hole (Laser) Minimum size for buried laser-drilled hole 0.1mil
Min Blind Hole (Mechanical) Minimum size for blind mechanical hole 0.2mil
Min Blind Hole (Laser) Minimum size for blind laser-drilled hole 0.1mil
Min Laser Hole Size Smallest laser hole (depth ≤ 55um) 0.10mil
Interlaminar Alignment Tolerance Alignment accuracy for multi-layer boards ±0.05mm (±0.002″)